Bambu Lab • 330 x 320 x 325 mm
Bambu Lab H2C

Bambu Lab H2C

Bambu Lab Released: November 14, 2025
Build Volume
330 x 320 x 325 mm
Print Area
Year
2025
Released
Kinematics
CoreXY
Motion System

Printer Highlights

Max Speed : 600 mm/s
Max Hotend Temp : 350°C
Chamber Enclosure : Enclosed
Auto-Leveling : Yes

About Bambu Lab H2C

Bambu Lab H2C is an enclosed CoreXY FDM 3D printer with a 330 × 320 × 325 mm build volume, up to 600 mm/s print speed, a 350°C hotend, a 120°C heated bed, a dual toolhead with vortek induction hotend changer, auto bed leveling, and up to 24-color printing support.

Last updated: November 11, 2026

General Information of Bambu Lab H2C

Printer Name

Bambu Lab H2C

Brand

Bambu Lab

Series

H2

Release Date

November 14, 2025

Build Volume & Chassis of Bambu Lab H2C

Build Volume

330 x 320 x 325 mm (13 x 12.6 x 12.8 in)

Build Volume (X)

330 mm (13 in)

Build Volume (Y)

320 mm (12.6 in)

Build Volume (Z)

325 mm (12.8 in)

Enclosed Chamber

Yes

Frame Type

Heavy-Duty Aluminum Enclosure

Machine Size

492 x 514 x 626 mm (19.4 x 20.2 x 24.6 in)

Machine Weight

32.5 kg (71.7 lbs)

Motion System & Kinematics of Bambu Lab H2C

Kinematics Type

CoreXY

Motion Axis Type

Carbon Rods & Precision Linear Rails

Kinematics Layout

Fixed Bed CoreXY

Rail System

Linear Rails (Y, Z) & Carbon Rods (X)

Dual Z-Axis

Yes

Extruder & Toolhead of Bambu Lab H2C

Extruder Type

Dual Toolhead with Vortek Induction Hotend Changer

Toolhead Count

2

Filament Diameter

1.75 mm

Nozzle Diameter

0.4 mm

Nozzle Material

Hardened Steel

Supported Nozzle Diameters

0.2 mm, 0.4 mm, 0.6 mm, 0.8 mm

Max Nozzle Temp

350°C

Multi-Material Ready

Yes

Max Colors / Materials

24 Colors

Multi-Material System

Vortek Induction Hotend System + Optional AMS (Up to 24 Colors)

Bed & Thermal System of Bambu Lab H2C

Build Plate Type

High-Temp Textured PEI

Heated Bed

Yes

Max Bed Temperature

120°C

Actively Heated Chamber

Yes

Max Chamber Temperature

65°C (Active Heating)

Automation & Electronics of Bambu Lab H2C

Auto Bed Leveling

Yes

Leveling Sensor Type

Eddy-Current Sensor + AI Optical Calibration

Filament Runout Sensor

Yes

Power Loss Recovery

Yes

Input Shaping (Resonance)

Yes

Built-in Camera

Yes

First Layer LiDAR

No

Part Cooling Fan

Auxiliary High-Flow Fan System

Hotend Fan

Closed-loop Fan

Software & Connectivity of Bambu Lab H2C

Firmware

Bambu OS 2.0

Compatible Slicers

Bambu Studio / OrcaSlicer

Connectivity

Wi-Fi, Bambu Bus, MicroSD

Display Screen

5.0-inch 720x1280 Touchscreen

Input Voltage

100-240V AC

Special Features

Vortek Hotend Change System (6 swappable induction hotends + primary left hotend), 8-second nozzle heating from room temperature, Up to 7 native swappable hotends (expandable to 24 with AMS), 65°C active chamber heating, 600 mm/s max print speed (1000 mm/s max toolhead travel speed)

Special Note on Bambu Lab H2C

The Bambu Lab H2C features a dual-toolhead motion carriage architecture integrating the Vortek induction hotend change system. The carriage docks up to 6 interchangeable induction hotends on an onboard rack alongside the primary left hotend (supporting up to 7 distinct materials natively, expandable to 24 with AMS), heating each nozzle in ~8 seconds without purge towers, with 600 mm/s max print speed and up to 1,000 mm/s toolhead travel speed.

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