Bambu Lab • 330 x 320 x 325 mm
Bambu Lab H3C

Bambu Lab H3C

Bambu Lab Released: November 3, 2026
Build Volume
330 x 320 x 325 mm
Print Area
Year
2026
Released
Kinematics
CoreXY
Motion System

Printer Highlights

Max Hotend Temp : 350°C
Chamber Enclosure : Enclosed
Auto-Leveling : Yes

About Bambu Lab H3C

Bambu Lab H3C is an enclosed CoreXY FDM 3D printer with a 330 × 320 × 325 mm build volume, a 350°C hotend, a 120°C heated bed, a nine-tool swaptek printtools toolchanger architecture, auto bed leveling, and up to 24-color printing support.

Last updated: November 11, 2026

General Information of Bambu Lab H3C

Printer Name

Bambu Lab H3C

Brand

Bambu Lab

Series

H3

Release Date

November 3, 2026

Build Volume & Chassis of Bambu Lab H3C

Build Volume

330 x 320 x 325 mm (13 x 12.6 x 12.8 in)

Build Volume (X)

330 mm (13 in)

Build Volume (Y)

320 mm (12.6 in)

Build Volume (Z)

325 mm (12.8 in)

Enclosed Chamber

Yes

Frame Type

Die-Cast Aluminum Unibody with Actively Heated Insulated Chamber

Machine Size

493 x 571 x 587 mm (19.4 x 22.5 x 23.1 in)

Machine Weight

36.28 kg (80 lbs)

Motion System & Kinematics of Bambu Lab H3C

Kinematics Type

CoreXY

Motion Axis Type

Precision Linear Rails with Closed-Loop Servo Steppers

Kinematics Layout

Enclosed CoreXY with Dual Z Independent Lead Screws

Rail System

High-Precision Hardened Steel Linear Rails

Dual Z-Axis

Yes

Extruder & Toolhead of Bambu Lab H3C

Extruder Type

Nine-Tool Swaptek PrintTools Toolchanger Architecture

Toolhead Count

9

Filament Diameter

1.75 mm / 2.85 mm

Nozzle Diameter

0.4 mm

Nozzle Material

Hardened Steel High-Flow Quick-Swap

Supported Nozzle Diameters

0.2 mm, 0.4 mm, 0.6 mm, 0.8 mm

Max Nozzle Temp

350°C

Multi-Material Ready

Yes

Max Colors / Materials

24 Colors

Multi-Material System

Bambu Lab AMS 3H (Integrated Combo, Expandable Up to 24 Colors)

Bed & Thermal System of Bambu Lab H3C

Build Plate Type

Double-Sided High-Temp Textured/Smooth PEI Spring Plate

Heated Bed

Yes

Max Bed Temperature

120°C

Actively Heated Chamber

Yes

Max Chamber Temperature

65°C (Active Heating)

Automation & Electronics of Bambu Lab H3C

Auto Bed Leveling

Yes

Leveling Sensor Type

Eddy-Current Pressure Sensor + AI Optical Calibration

Filament Runout Sensor

Yes

Power Loss Recovery

Yes

Input Shaping (Resonance)

Yes

Built-in Camera

Yes

First Layer LiDAR

No

Part Cooling Fan

Closed-Loop Centrifugal Auxiliary Cooling Array

Hotend Fan

Axial High-Static Pressure Fan

Software & Connectivity of Bambu Lab H3C

Firmware

Bambu OS Enterprise

Compatible Slicers

Bambu Studio / OrcaSlicer

Connectivity

Wi-Fi 6, Gigabit Ethernet, USB Type-C

Display Screen

5.0-inch 854x480 Touchscreen

Input Voltage

100-240V AC

Special Features

Nine-tool Swaptek PrintTools toolchanger architecture, Up to 24 materials with AMS expansion across 9 native tool paths, 330x320x325mm build volume with 65°C actively heated chamber, 1,400 mm/s max toolhead travel speed & 25,000 mm/s² acceleration, H3C + AMS 3H multi-material combo configuration (493x571x587mm, 36.28 kg)

Special Note on Bambu Lab H3C

The Bambu Lab H3C features the nine-tool Swaptek PrintTools toolchanging system supporting 1.75 mm and 2.85 mm filament inputs across a 330 x 320 x 325 mm volume with 65°C active chamber heating, 25,000 mm/s² acceleration, and up to 1,400 mm/s max toolhead movement speed (extrusion print speed is lower and filament/flow-limited). Supports 9 native tool paths, expandable up to 24 materials with AMS 3H units. Launch package ($2,499 MSRP) reflects H3C + AMS 3H Combo.

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