Bambu Lab H3C
Bambu Lab H3C
Printer Highlights
About Bambu Lab H3C
Bambu Lab H3C is an enclosed CoreXY FDM 3D printer with a 330 × 320 × 325 mm build volume, a 350°C hotend, a 120°C heated bed, a nine-tool swaptek printtools toolchanger architecture, auto bed leveling, and up to 24-color printing support.
General Information of Bambu Lab H3C
Printer Name
Bambu Lab H3C
Brand
Bambu Lab
Series
H3
Release Date
November 3, 2026
Build Volume & Chassis of Bambu Lab H3C
Build Volume
330 x 320 x 325 mm (13 x 12.6 x 12.8 in)
Build Volume (X)
330 mm (13 in)
Build Volume (Y)
320 mm (12.6 in)
Build Volume (Z)
325 mm (12.8 in)
Enclosed Chamber
Yes
Frame Type
Die-Cast Aluminum Unibody with Actively Heated Insulated Chamber
Machine Size
493 x 571 x 587 mm (19.4 x 22.5 x 23.1 in)
Machine Weight
36.28 kg (80 lbs)
Motion System & Kinematics of Bambu Lab H3C
Kinematics Type
CoreXY
Motion Axis Type
Precision Linear Rails with Closed-Loop Servo Steppers
Kinematics Layout
Enclosed CoreXY with Dual Z Independent Lead Screws
Rail System
High-Precision Hardened Steel Linear Rails
Dual Z-Axis
Yes
Extruder & Toolhead of Bambu Lab H3C
Extruder Type
Nine-Tool Swaptek PrintTools Toolchanger Architecture
Toolhead Count
9
Filament Diameter
1.75 mm / 2.85 mm
Nozzle Diameter
0.4 mm
Nozzle Material
Hardened Steel High-Flow Quick-Swap
Supported Nozzle Diameters
0.2 mm, 0.4 mm, 0.6 mm, 0.8 mm
Max Nozzle Temp
350°C
Multi-Material Ready
Yes
Max Colors / Materials
24 Colors
Multi-Material System
Bambu Lab AMS 3H (Integrated Combo, Expandable Up to 24 Colors)
Bed & Thermal System of Bambu Lab H3C
Build Plate Type
Double-Sided High-Temp Textured/Smooth PEI Spring Plate
Heated Bed
Yes
Max Bed Temperature
120°C
Actively Heated Chamber
Yes
Max Chamber Temperature
65°C (Active Heating)
Print Speed & Performance of Bambu Lab H3C
Typical Print Speed
400 mm/s
Max Acceleration
25,000 mm/s²
Max Flow Rate
40 mm³/s
Min Layer Height
0.05 mm
Max Layer Height
0.35 mm
Speed Benchy Time
11 min
Automation & Electronics of Bambu Lab H3C
Auto Bed Leveling
Yes
Leveling Sensor Type
Eddy-Current Pressure Sensor + AI Optical Calibration
Filament Runout Sensor
Yes
Power Loss Recovery
Yes
Input Shaping (Resonance)
Yes
Built-in Camera
Yes
First Layer LiDAR
No
Part Cooling Fan
Closed-Loop Centrifugal Auxiliary Cooling Array
Hotend Fan
Axial High-Static Pressure Fan
Software & Connectivity of Bambu Lab H3C
Firmware
Bambu OS Enterprise
Compatible Slicers
Bambu Studio / OrcaSlicer
Connectivity
Wi-Fi 6, Gigabit Ethernet, USB Type-C
Display Screen
5.0-inch 854x480 Touchscreen
Input Voltage
100-240V AC
Special Features
Nine-tool Swaptek PrintTools toolchanger architecture, Up to 24 materials with AMS expansion across 9 native tool paths, 330x320x325mm build volume with 65°C actively heated chamber, 1,400 mm/s max toolhead travel speed & 25,000 mm/s² acceleration, H3C + AMS 3H multi-material combo configuration (493x571x587mm, 36.28 kg)
Special Note on Bambu Lab H3C
The Bambu Lab H3C features the nine-tool Swaptek PrintTools toolchanging system supporting 1.75 mm and 2.85 mm filament inputs across a 330 x 320 x 325 mm volume with 65°C active chamber heating, 25,000 mm/s² acceleration, and up to 1,400 mm/s max toolhead movement speed (extrusion print speed is lower and filament/flow-limited). Supports 9 native tool paths, expandable up to 24 materials with AMS 3H units. Launch package ($2,499 MSRP) reflects H3C + AMS 3H Combo.
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